Browsing by Autor "Rich Rice"

Filter results by typing the first few letters
Now showing 1 - 1 of 1
  • Thumbnail Image
    Item type: Item ,
    SiP: Bringing Ideas to High Volume Reality
    (International Microelectronics Assembly and Packaging Society, 2015) Rich Rice
    The semiconductor industry has entered a phase of accelerating integration, on both the corporate and product fronts. Companies must provide integrated solutions to end electronic markets to maintain their business channels and revenue growth. System-in-Package (SiP) provides an avenue for product designers to increase functionality while reducing form factor, which are absolute requirements for a vast number of applications particularly in the mobile product space. This presentation will cover the industry landscape, and highlight the key packaging technologies to be deployed in coming years to enable semiconductor and electronic companies meet evolving market needs.