SiP: Bringing Ideas to High Volume Reality

Abstract

The semiconductor industry has entered a phase of accelerating integration, on both the corporate and product fronts. Companies must provide integrated solutions to end electronic markets to maintain their business channels and revenue growth. System-in-Package (SiP) provides an avenue for product designers to increase functionality while reducing form factor, which are absolute requirements for a vast number of applications particularly in the mobile product space. This presentation will cover the industry landscape, and highlight the key packaging technologies to be deployed in coming years to enable semiconductor and electronic companies meet evolving market needs.