Reversing Payoffs in the Die-Under-The-Cup Paradigm Increases Honesty

Date

2021

Authors

Journal Title

Journal ISSN

Volume Title

Publisher

RELX Group (Netherlands)

Abstract

Description

Keywords

Reversing, Honesty, Die (integrated circuit)

Citation

DOI

10.2139/ssrn.3990039

URI

https://doi.org/10.2139/ssrn.3990039
 https://andeanlibrary.org/handle/123456789/71469

Collections

Artículo Científico Publicado